PCB Design Parameters

offshore_pcb_blog001

Name Min. dimensions
A, B, C via, buried via aspect ratio
final diameter
via pad
annular ring
1:20
100µm
300µm
100µm (enclosing)
D blind via, mechanical max. Ø
400µm
aspect ratio
final diameter
via pad
annular ring
1:1
100µm
400µm
150µm (enclosing)
E blind via, laser aspect ratio
final diameter
via pad
annular ring
1:1
75µm
225µm
75µm* (enclosing)
F stacked via aspect ratio
final diameter
via pad
annular ring
1:1 – 1:12 **
100µm
300µm
100µm
G staggered via aspect ratio
final diameter
via pad
annular ring
1:1 – 1:12 **
100µm
300µm
100µm
H, I
conductor traces (outer, inner) –
see Conductor / Copper Thickness
width
spacing
60µm
60µm
J conductor / pad to milling edge spacing 200µm
K conductor / pad to via spacing 200µm
L solder-stop coating spacing
bridge width
50µm (enclosing)
100µm

* Annular ring depends on copper thickness! Please ask for critical designs.
** Aspekt ratio depends on Ø. 100µm 1:1, >100µm 1:4, >150µm 1:10, >200µm 1:12

2017-10-24T22:22:45+00:00November 15th, 2016|PCB Manufacturing Technology Community|