File Requirements

//File Requirements

Your complete Files will enable us to work effectively and timely saved in PCB Assembly.

For PCBA inquiry please would you send us:

  • Inquiry sheet with the specification of PCB (PCB inquiry sheet);
  • PCAD or Gerber data of PCB (in CAM350 or GERBER RS-274X format);
  • Bill of Material (BOM), which should include complete model names & brands at least for active parts like ICs and for connectors. For passive parts please provide at least the specification like: resistance / capacity, voltage, tolerance and code for size of the part – like “0402” (example _of_bom);

For PCBA order please would you send us:

  • Order sheet with the specification of PCB (the same data as in inquiry sheet);
  • PCAD & Gerber data of PCB (in CAM350 or/and GERBER RS-274X format);
  • Bill of Material (BOM);
  • Assembly places list: model name of parts with marking of assembly place each as stipulated in notation print (example_of_Assembly_places List)
  • Coordinates And Orientation (CAO) List: of pairs (“X” & “Y” ) of coordinates of the centre of each part, where to be located on the board), marking if topside or bottom side assembly, orientation of parts in degrees (0 / 90 / 180 / 270 degree) (example_of_cao);
  • Instruction for PCBA requested test (example_of_instruction_for_pcba_e-test).

In certain cases we might need following additionally:

  • Assembly Drawing;
  • Schematic Diagram;
  • Drawings for some fabricated parts (e.g. connectors);
  • Net List and Node Count (if functional test required);
  • Specification Sheet for dimensional Data of non-standard components;

Outgoing tests for PCB assembly:

Following tests of the assembled PCBA can be performed:
1.  Basic functional test – as per clients instruction, e.g. resistance measured at pairs of test points, manually or by flying probe;
2. In circuit test (ICT): as per client instruction response of test signal is measured manually (for sample production) or by a ICT test adapter;
3. X-ray: control of quality of BGA solder places;
4. AOI: control of correct assembly of components (their location, orientation).
5. Automatic tin thickness measuring before soldering.

2019-07-26T22:47:24+00:00November 13th, 2016|Uncategorized|