Assembly Capability

//Assembly Capability
  • China PCB assembly supplier

Weller Technology offers an extensive broad arrange of electrical and electromechanical, and PCB (rigid PCB and flex PCB) manufacturing services. These services can include Engineering, PCB assembly, Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics. Innovation and investment in keeping Weller Technology at the cutting edge helps maintain our position as a professional industry leader. Our state of the art 4000 square meters electronic assembly facility contains an impressive list of equipment including over 1000 square meters medical clean room. Our assembly capabilities include:

  • Surface Mount (SMT) Assembly
  • Through-Hole Assembly
  • Mixed Technologies challenges
  • Single, Double, Multi Layer Rigid, Flex, Rigid-Flex PCB assembly
  • Solder & Washing PCB
  • AOI “Automated Optical Inspection”
  • X-Ray inspection for QFN, BGA components
  • Functional Testing
  • Repaid Prototyping
  • Repair Sevice
  • Conformal Coating
  • Potting
  • Box Build Assembly
  • components sourcing & Logistics

SMT Assembly

Components Resistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connetcors, Headers, some through hole parts, etc.
Components Min x Max (W x L) (0.254 x 0.13mm ) 01005 – 100 x 45mm (3.94 x 1.77″)
Components Min x Max Height .005 – 2.00″
PCB Materials Flex, rigid-flex, FR materials, CEM materials, aluminum, single-double sided, multi-layered, etc.
Solder Paste Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc.  With Alpha brand:ALPHA OM-340
Solder Paste Flux Lead-free, water soluble, rosin, No-clean, etc.
PCB Min & Max (W x L) 100″ x .100″ min (Pallets) – 30″ x 30″ max
PCB Thickness Min – Max Thickness .010″(Fiber) (1mill Flex) min – .500″ max
Paste Inspection 2D, Laser

Axial Insertion

Cycle Rate 14,000
Component Types Capacitors, resistors, diodes, jumpers, etc.
Hole Span 0.300″min – 0.950″max
Component Body Diameter 0.100″ min – 0.460″ width max
Lead Wire Diameter 0.015’min – 0.032″max
Pcb Min x Max (WxL) 2 x 2″” Min – 22′ x 18.5″ Max
Insertable Area (WxL) 20″ x 18.5″
Board Error Correction BEC feature compensation for PCB pattern errors
Verifier Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, etc.

Radial Insertion

Cycle Rate 22,000
Component Types Capacitors (electrolytic, ceramic, box, & film, hairpin resistors, diodes,SIPs, LEDs, tact switches, coils, pots, fuse clips, lamps, fuses, etc.
Compenent Max Size (LxDxH) 0.512″ x 0.512″ x 0.906″
Pcb Min x Max (WxL) 2 x 2″” Min – 22′ x 18.5″ Max
CPCB Thickness Min x Max .010 Min – 0.250″ Max
Insertable Area (WxL) 20″ x 18.5″
Board Error Correction BEC feature compensation for PCB pattern errors
Verifier Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, etc.

DIP (dual inline-pin package) Insertion

Cycle Rate 4,500
Component Types .300 Dip & Sockets .600 Dip & Sockets
Compenent Max Size (LxDxH) 0.512″ x 0.512″ x 0.906″
Pcb Min x Max (WxL) 2 x 2″ Min – 22′ x 18.5″ Max
PCB Thickness Min x Max .010 Min – 0.250″ Max
Insertable Area (WxL) 20″ x 18.5″
Board Error Correction BEC feature compensation for PCB pattern errors
Verifier Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, etc.

Solder Processing

Solder types Manual, Mass wave, Seletcive, hand, etc.
Solder metals Lead (62Sn/36Pb/2Ag) & Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), etc.
Flux materials VOC-free, Lead-free, water soluble, rosin, No-clean, etc.
Fluxing Applicators Ultra sonic, spray, drop jet, foam, etc.
PCB Min & Max (WxL) .100 x .100 min (Pallets) – 30″ x 30″ max
PCB Thickness Min – Max .010″ min – 1″ max
PCB materials Flex, rigid-flex, FR materials, cem materials, etc.

AOI “Automated Optical Inspection”

Inspection Types 3D-X-Ray, AOI Automatic Optical Inspection,
Magnification 255 time
Solder inspection Color & X-ray
PCB size Min – Max (WxL) .100″ x.100 min – .30″ x 30″max
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, etc.

Testing

Functional Burn-in, power up, cycle, etc.
Flying Probe 24 probe, 35″ x 25″max
RF Synthesized Signal Generator, Frequency Synthesizers, etc.

Repair & Upgrade rework

SMD Passives (03015 on up), processors, BGA, etc.
Through Hole Axial, radial, dip, sip, transformers, connetcors, headers, etc.
Cable Rigid wire, flex circuit, fiber optic, connetcors, etc.
PCB Repair Trace, via, through hole, smt, etc.

Conmformal Coating

Coating Materials Acrylic, silicon, UV, etc.
SCS Precisioncoat spray and despense system Capable of applying solvent and water based coatings, along with solids with accuracy of 0.001 inches
Minimum/ Maximum Substrate size LxW 2×2″ -20×20″
Maximum Substrate size Height 4″

Potting

Epoxy Materials 2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, etc.

Box build Assembly

Box Build Assembly Wiring, assembly, testing, labeling, shipping, etc.

Components Procurement

Purchasing World wide
Component Tacking 100% component & product tracking
Component Guarantee Hi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies

 

2019-08-07T22:43:14+00:00November 13th, 2016|PCB Assembly|