|Flex PCB Capability|
|No.||Item||Flex PCB Technical Data|
|1||PCB Layer Count||1~6Layers|
|2||Min. Line Width/Space||18um(finish Cu): 3.5/3.5mil|
|35um(finish Cu): 4/4mil|
|3||Min Space Between Coverlay Opening||0.2mm|
|4||Edge of Coverlay Opening to Trace||0.20mm(preferred)|
|5||Min Space between coverlay and solder pad||0.15mm|
|6||Polyimide Films||0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ)|
|7||Thermabond Adhesive||Thermosetting Adhesive, 3M high adhesion tape|
|8||Copper Foils (RA or ED)||1/3oz, 1/2oz, 1oz|
|9||Stiffeners||Polyimide, Rigid FR4, metal|
|10||Solder Resist||Coverlay, LPI|
|11||Min. Finished Hole size||0.2mm|
|12||Max. Finished Hole size||6.30mm|
|14||Min.space between holes||0.15mm|
|15||Minimum conductor edge to outline edge||≥0.1mm|
|16||Minimum space between coverlay and conductor||± 0.15mm|
|17||Hole to outline edge||≥ 0.10mm|
|18||Tooling tolerance||Knife(Soft) tooling||± 0.25mm|
|Steel(Hard) tooling||± 0.05mm|
|CNC drill/rout||± 0.10mm|
|19||Maximum Layer to Layer Mis-registration||± 0.10mm|
|20||Copper Plated Thickness (PTH only)||8~15um;20~30um;30~70um(special)|
|21||Surface Finish||Immersion Gold, Plating Hard Gold, OSP|
Flex and Rigid-Flex boards
Please observe the following Design-Rules for your Flex- or Rigid-Flex circuit boards. Powered by China Printed Circuit Board manufacturer (offshore PCB Manufacturer),
For designers of flexible circuit boards we recommend the IPC-2223 Guideline / Design guidelines for flexible circuit boards, which is available from the IPC online store.
Calculation of the bending radius
The minimum bending radius r results from the factor 6 to 25 (depending on the number of layers or application) multiplied by h, the overall height of the flexible part.
2 layers flexible PCB; overall height of flexible part: 300µm
minimum bending radius r = 10 x 300µm = 3000µm = 3mm
Flexible PCB for dynamic installation; overall height of flexible part: 400µm
minimum bending radius r = 25 x 400µm = 10000µm = 10mm
Design of bending areas
Divide wide conductor traces into narrower conductor traces in the bending area.
Fill open regions in the bending area with blind conductors.
Ensure a perpendicular path of the conductor traces to the bending axis. Avoid pads plated-through holes in the bending area.
The bending area may be optimized depending on the application.
spontaneous and frequent bending
Optimization for dynamic bending:
single occurrence bending, such as for a bending tool
Optimization for durable bends:
For 2 or more flex layers, please ensure an alternating arrangement of the conductor traces on the front and back sides of the flexible portion.
Use curves instead of corners in the conductor trace path.