6Layer copper coin buried PCB

6 layers
FR4 Tg 170,S1000-2
Immersion gold: IPC-4552
1/3 copper,LDI process
PCB thickness: 1.6mm+/-0.16mm

PCB layer count 6 layers
PCB Laminate Material FR4
Tg of of PCB laminate material Tg170,ShengYi S1000-2
Overall finished PCB thickness (mm) 1.60+/-10%,measured on the soldermask
Finished PCB copper thickness (OZ) (1/3)/1/1/1/1/(1/3)
PCB surface finishing Immersion gold: 2u” (min) based IPC 4552
Soldermask color Matte Green
Silkscreen color White Taiyo PSR4000
PCB size (mm) 200.00 X 180.00 (4 up/panel)
PCB Profile  Routing,(2.0mm width routing path)
Minimum plated through hole size (mm) 0.20
Minimum track width/spacing (mm) 0.10/0.10
VIP technolog (Y/N) Yes,(based IPC-6012B)
Controlled Impedance (Single ended) (Y/N) Yes, 45 ohm+/-5% ohm
Controlled Impedance (Differential) (Y/N) No.
Peelable mask (Y/N) No.
Chamfer gold fingers (Y/N) No.
IPC class 2 or 3 Class 2
RoHS (Y/N) Yes
Blind and buried via holes 1+1+2+1+1
Other Coopper coin embeded technology

2019-07-26T15:22:17+00:00December 23rd, 2016|PCB Manufacturing Product Show|