PCB Assembly Product Show

//PCB Assembly Product Show

Micro BGA PCB assembly

2019-07-24T15:03:04+00:00October 1st, 2018|PCB Assembly Product Show|

1. Ball Grid Array (BGA) 2. Ultra-Fine Ball Grid Array (uBGA) 3. Quad Flat Pack No-Lead (QFN) 4. Quad Flat Package (QFP) 5. Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP) 7. Small Chip Packages (Pitch of 0.2 mm) 8. Lead free assembly process

flex PCB assembly

2019-07-24T16:09:05+00:00February 3rd, 2018|PCB Assembly Product Show|

1. Ball Grid Array (BGA) 2. Ultra-Fine Ball Grid Array (uBGA) 3. Quad Flat Pack No-Lead (QFN) 4. Quad Flat Package (QFP) 5. Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP) 7. Small Chip Packages (Pitch of 0.2 mm) 8. Lead free assembly process

BGA PCB assembly

2019-07-24T16:45:16+00:00February 3rd, 2018|PCB Assembly Product Show|

1. Ball Grid Array (BGA) 2. Ultra-Fine Ball Grid Array (uBGA) 3. Quad Flat Pack No-Lead (QFN) 4. Quad Flat Package (QFP) 5. Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP) 7. Small Chip Packages (Pitch of 0.2 mm) 8. Lead free assembly process

10-layers-HDI-PCB-assembly

2019-07-26T11:54:49+00:00May 16th, 2017|PCB Assembly Product Show|

1. Ball Grid Array (BGA) 2. Ultra-Fine Ball Grid Array (uBGA) 3. Quad Flat Pack No-Lead (QFN) 4. Quad Flat Package (QFP) 5. Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP) 7. Small Chip Packages (Pitch of 0.2 mm) 8. Lead free assembly process